STTH310_07 datasheet(3/7 Pages) STMICROELECTRONICS

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STTH310

Characteristics

3/7

Figure 1.

Conduction losses versus

average current

Figure 2.

Forward voltage drop versus

forward current

P(W)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

(A)

F(AV)

δ=tp/T

δ = 1

δ = 0.05

δ = 0.5

δ = 0.2

δ = 0.1

(A)

0.1

1.0

10.0

100.0

0.0

0.5

1.0

1.5

2.0

2.5

T =25°C

(maximum values)

(V)

T =150°C

(maximum values)

T =150°C

(typical values)

Figure 3.

Relative variation of thermal

impedance junction ambient

versus pulse duration (epoxy FR4,

Lleads = 10 mm) (DO-201AD)

Figure 4.

Relative variation of thermal

impedance junction ambient

versus pulse duration (epoxy FR4,

S = 1cm2) (SMC)

Figure 5.

Thermal resistance junction to

ambient versus copper surface

under each lead (epoxy printed

circuit board FR4, copper

thickness: 35 µm)

Z/R

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

δ=tp/T

t (s)

Z/R

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

δ=tp/T

t (s)

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

(°C/W)

th(j-a)

100

110

012

345

SMB

DO-201AD

=10mm

leads

S(cm²)

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