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STMPE1601 Arkusz danych(PDF) 58 Page - STMicroelectronics |
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STMPE1601 Arkusz danych(HTML) 58 Page - STMicroelectronics |
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58 / 61 page ![]() Package mechanical data STMPE1601 58/61 16 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com Figure 11. TFBGA25 package outline Table 25. TFBGA25 mechanical data Dim. mm. inch Min Typ Max Min Typ Max A 1.0 1.1 1.16 39.4 43.3 45.7 A1 0.25 9.8 A2 0.78 0.86 30.7 33.9 b 0.25 0.30 0.35 9.8 11.8 13.8 D 2.9 3.0 3.1 114.2 118.1 122.0 D1 2 78.8 E 2.9 3.0 3.1 114.2 118.1 122.0 E1 2 78.8 e 0.5 19.7 SE 0.25 9.8 |
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