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STPS5L60 Arkusz danych(PDF) 5 Page - STMicroelectronics

Numer części STPS5L60
Szczegółowy opis  Power Schottky rectifier
PDF  8 Pages
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Producent  STMICROELECTRONICS [STMicroelectronics]
Strona internetowa  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STPS5L60 Arkusz danych(HTML) 5 Page - STMicroelectronics

  STPS5L60 Datasheet HTML 1Page - STMicroelectronics STPS5L60 Datasheet HTML 2Page - STMicroelectronics STPS5L60 Datasheet HTML 3Page - STMicroelectronics STPS5L60 Datasheet HTML 4Page - STMicroelectronics STPS5L60 Datasheet HTML 5Page - STMicroelectronics STPS5L60 Datasheet HTML 6Page - STMicroelectronics STPS5L60 Datasheet HTML 7Page - STMicroelectronics STPS5L60 Datasheet HTML 8Page - STMicroelectronics  
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STPS5L60
Characteristics
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Figure 15.
Thermal resistances versus leads length DO-201AD
Figure 11.
Forward voltage drop versus
forward current (low level)
Figure 12.
Forward voltage drop versus
forward current (high level)
IFM(A)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0.60
Tj=25°C
(Maximum values)
Tj=125°C
(Maximum values)
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
Tj=125°C
(Typical values)
VFM(V)
IFM(A)
0
5
10
15
20
25
30
35
40
45
50
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Tj=25°C
(Maximum values)
Tj=125°C
(Maximum values)
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
Tj=125°C
(Typical values)
VFM(V)
Figure 13.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, Cu = 35 µm) SMC
Figure 14.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, Cu = 35 µm), DO-201AD
R
(°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
SMC
S
(cm²)
CU
Rth(j-a)(°C/W)
0
10
20
30
40
50
60
70
80
01
2345
678
9
10
DO-201AD
S(cm²)
0
10
20
30
40
50
60
70
80
510
15
20
25
Lleads(cm)
Rth(j-a): Epoxy printed circuit board FR4 (Cu=35µm)
Rth(j-l)
Rth(°C/W)



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