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STTS424E02 Arkusz danych(PDF) 42 Page - STMicroelectronics |
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STTS424E02 Arkusz danych(HTML) 42 Page - STMicroelectronics |
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42 / 51 page ![]() Package mechanical data STTS424E02 42/51 10 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a halogen-free and lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 15. DFN8 – 8-lead dual flat, no-lead (2 mm x 3 mm) package outline (DA) 1. Drawing is not to scale. DA_ME |
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