Packing information

ESDA18-1F2

6/8

Figure 14.

Flip Chip tape and reel specification

Note:

More packing information is available in the application notes:

AN1235: “Flip Chip: Package description and recommendations for use”

AN1751: "EMI Filters: Recommendations and measurements"

Figure 12.

Footprint recommendations

Figure 13.

Marking

Copper pad Diameter:

250 µm recommended, 300µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 315 µm copper pad diameter

x

y

x

w

z

w

E

Dot, ST logo

xx = marking

yww = datecode

(y = year

ww = week)

z = manufacturing location

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 ± 0.1

1.0

4 ± 0.1

Ø 1.5 ± 0.1

0.73 ± 0.05