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TDA7563ASM Arkusz danych(PDF) 20 Page - STMicroelectronics

Numer części TDA7563ASM
Szczegółowy opis  4 x 50W multifunction quad power amplifier with built-in diagnostics feature
PDF  35 Pages
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Producent  STMICROELECTRONICS [STMicroelectronics]
Strona internetowa  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

TDA7563ASM Arkusz danych(HTML) 20 Page - STMicroelectronics

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Thermal protection
TDA7563A
20/35
5
Thermal protection
Thermal protection is implemented through thermal foldback (Figure 28).
Thermal foldback begins limiting the audio input to the amplifier stage as the junction
temperatures rise above the normal operating range. This effectively limits the output power
capability of the device thus reducing the temperature to acceptable levels without totally
interrupting the operation of the device.
The output power will decrease to the point at which thermal equilibrium is reached.
Thermal equilibrium will be reached when the reduction in output power reduces the
dissipated power such that the die temperature falls below the thermal foldback threshold.
Should the device cool, the audio level will increase until a new thermal equilibrium is
reached or the amplifier reaches full power. Thermal foldback will reduce the audio output
level in a linear manner.
Three Thermal warning are available through the I2C bus data.
Figure 28.
Thermal foldback diagram
Tj ( °C)
TH. SH.
START
TH. SH.
END
Vout
TH. WARN.
ON
Tj ( °C)
Vout
Tj ( °C)
SD
(with same input
signal)
< TSD
CD out
TH. WARN.
ON
TH. WARN.
ON
125°
140°
155°
> T



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