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TDA7563ASM Arkusz danych(PDF) 20 Page - STMicroelectronics |
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TDA7563ASM Arkusz danych(HTML) 20 Page - STMicroelectronics |
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20 / 35 page ![]() Thermal protection TDA7563A 20/35 5 Thermal protection Thermal protection is implemented through thermal foldback (Figure 28). Thermal foldback begins limiting the audio input to the amplifier stage as the junction temperatures rise above the normal operating range. This effectively limits the output power capability of the device thus reducing the temperature to acceptable levels without totally interrupting the operation of the device. The output power will decrease to the point at which thermal equilibrium is reached. Thermal equilibrium will be reached when the reduction in output power reduces the dissipated power such that the die temperature falls below the thermal foldback threshold. Should the device cool, the audio level will increase until a new thermal equilibrium is reached or the amplifier reaches full power. Thermal foldback will reduce the audio output level in a linear manner. Three Thermal warning are available through the I2C bus data. Figure 28. Thermal foldback diagram Tj ( °C) TH. SH. START TH. SH. END Vout TH. WARN. ON Tj ( °C) Vout Tj ( °C) SD (with same input signal) < TSD CD out TH. WARN. ON TH. WARN. ON 125° 140° 155° > T |
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