Package mechanical data

STn8810

12/15

2

Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 3.

TFBGA outline (bottom and side views)

Note:

The terminal A1 corner is identified on the top surface by using a corner chamfer,

ink or metallized markings.

13

5

7

9

11

13

15

17

19

21

2

4

6

8

10

12

14

16

18

20

22

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

U

V

W

Y

AA

AB

e

D1

D

f

A2

C

Seating

plane

A

A1

C

ddd

Bottom view

A1 ball pad corner

(see note)

φb (288+36 = 324 balls)

Side view