STPC12GDYC datasheet(103/111 Pages) STMICROELECTRONICS

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STPC12GDYC Arkusz danych(PDF) 103 Page - STMicroelectronics

Numer części	STPC12GDYC

Szczegółowy opis	X86 Core PC Compatible System-on-Chip for Terminals

PDF	111 Pages

Scroll/Zoom	100%

Producent	STMICROELECTRONICS [STMicroelectronics]

Strona internetowa	http://www.st.com

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103 / 111 page

DESIGN GUIDELINES

Issue 1.0 - July 24, 2002

103/111

As the PCB acts as a heat sink, the layout of top

and ground layers must be done with care to

maximize the board surface dissipating the heat.

The only limitation is the risk of losing routing

channels. Figure 6-36 and Figure 6-37 show a

routing with a good thermal dissipation thanks to

an optimized placement of power and signal vias.

The ground plane should be on bottom layer for

the best heat spreading (thicker layer than internal

ones) and dissipation (direct contact with air). .

Figure 6-36. Layout for Good Thermal Dissipation - top layer

3.3V ball

2.5V ball (Core / PLLs)

Via

STPC ball

GND ball

Not Connected ball

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