M95256_0807 datasheet(36/44 Pages) STMICROELECTRONICS

36 / 44 page

Package mechanical data

M95256, M95256-W, M95256-R

36/44

Package mechanical data

In order to meet environmental requirements, ST offers the M95256 in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at www.st.com.

Figure 19.

SO8N – 8 lead plastic small outline, 150 mils body width, package outline

Drawing is not to scale.

Table 20.

SO8N – 8 lead plastic small outline, 150 mils body width, package data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

1.75

0.0689

0.1

0.25

0.0039

0.0098

1.25

0.0492

0.28

0.48

0.011

0.0189

0.17

0.23

0.0067

0.0091

ccc

0.1

0.0039

4.9

4.8

0.1929

0.189

0.1969

5.8

6.2

0.2362

0.2283

0.2441

3.9

3.8

0.1535

0.1496

0.1575

e1.27

0.05

0.25

0.5

0.0098

0.0197

0°8°

0.4

1.27

0.0157

0.05

1.04

0.0409

SO-A

ccc

h x 45˚

0.25 mm

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