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TS420 Arkusz danych(PDF) 3 Page - STMicroelectronics |
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TS420 Arkusz danych(HTML) 3 Page - STMicroelectronics |
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3 / 8 page ![]() TS420 Series 3/8 OTHER INFORMATION Note: x = voltage Part Number Marking Weight Base Quantity Packing mode TS420-x00B TS420x00 0.3 g 75 Tube TS420-x00B-TR TS420x00 0.3 g 2500 Tape & reel TS420-x00H TS420x00 0.4 g 75 Tube TS420-x00T TS420x00T 2.3 g 50 Tube Fig. 1: Maximum average power dissipation versus average on-state current. Fig. 2-1: Average and D.C. on-state current versus case temperature. Fig. 2-2: Average and D.C. on-state current versus ambient temperature (device mounted on FR4 with recommended pad layout) (DPAK). Fig. 3: Relative variation of thermal impedance junction to ambient versus pulse duration (recommended pad layout, FR4 PC board) for DPAK. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 P(W) α = 180° IT(av)(A) 360° α 0 25 50 75 100 125 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 IT(av)(A) DC α = 180° Tcase(°C) 0 25 50 75 100 125 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 IT(av)(A) α = 180° DC α = 180° DPAK (S = 0.5cm 2) IPAK DC Tamb(°C) |
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