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ADA4505-2ACBZ-R7 Arkusz danych(PDF) 18 Page - Analog Devices |
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ADA4505-2ACBZ-R7 Arkusz danych(HTML) 18 Page - Analog Devices |
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18 / 20 page ![]() ADA4505-2/ADA4505-4 Rev. A | Page 18 of 20 COMPLIANT TO JEDEC STANDARDS MO-187-AA OUTLINE DIMENSIONS 0.80 0.60 0.40 8° 0° 4 8 1 5 3.20 3.00 2.80 PIN 1 0.65 BSC SEATING PLANE 0.38 0.22 1.10 MAX COPLANARITY 0.10 0.23 0.08 5.15 4.90 4.65 3.20 3.00 2.80 0.95 0.85 0.75 0.15 0.00 Figure 54. 8-Lead Mini Small Outline Package [MSOP] (RM-8) Dimensions shown in millimeters SEATING PLANE 0.50 BALL PITCH 1.460 1.420 SQ 1.380 0.270 0.240 0.210 0.380 0.355 0.330 0.340 0.320 0.300 0.650 0.595 0.540 BOTTOM VIEW (BALL SIDE UP) TOP VIEW A 1 2 3 B C BALL 1 IDENTIFIER COPLANARITY 0.075 Figure 55. 8-Ball Wafer Level Chip Scale Package [WLCSP] (CB-8-2) Dimensions shown in millimeters |
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