SPEC NO: DSAI6845

REV NO: V.1

DATE: SEP/08/2008

PAGE: 9 OF 10

APPROVED: WYNEC

CHECKED: Allen Liu

DRAWN: S.P.Chen

ERP: 1212000024

3.2X2.8mm SMD LED WITH CERAMIC SUBSTRATE

Designing the Position of LED on a Board.

1.No twist/warp/bent/or other stress shall be applied to the board after mounting LED with

solder to avoid a crack of LED package.

Refer to the following recommended position and direction of LED.

Appropriate LED mounting is to place perpendicularly against the stress affected side

.

2.Depending on the position and direction of LED,the mechanical stress on the LED package can be changed.

Refer to the following figure.

3.Do not split board by hand.Split with exclusive special tool.

4.If an aluminum circuit board is used,a large stress by thermal shock might cause a solder crack.

For this reason,it is recommended an appropriate verification should be taken before use.

yalin

數位簽署者：yalin

DN：cn=yalin, o, ou=SPEC

專用, email=sjhou@cn.

kingbright.com, c=<無>

日期︰2008.09.08 19:40:30

+08'00'