PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

7702301EA

ACTIVE

CDIP

J

16

1

None

Call TI

Level-NC-NC-NC

CD4518BE

ACTIVE

PDIP

N

16

25

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

CD4518BF

ACTIVE

CDIP

J

16

1

None

Call TI

Level-NC-NC-NC

CD4518BF3A

ACTIVE

CDIP

J

16

1

None

Call TI

Level-NC-NC-NC

CD4518BM

ACTIVE

SOIC

D

16

40

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4518BM96

ACTIVE

SOIC

D

16

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4518BNSR

ACTIVE

SO

NS

16

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4518BPW

ACTIVE

TSSOP

PW

16

90

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

CD4518BPWR

ACTIVE

TSSOP

PW

16

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

CD4520BE

ACTIVE

PDIP

N

16

25

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

CD4520BF

ACTIVE

CDIP

J

16

1

None

Call TI

Level-NC-NC-NC

CD4520BF3A

ACTIVE

CDIP

J

16

1

None

Call TI

Level-NC-NC-NC

CD4520BM

ACTIVE

SOIC

D

16

40

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4520BM96

ACTIVE

SOIC

D

16

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4520BNSR

ACTIVE

SO

NS

16

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1 YEAR/

Level-1-235C-UNLIM

CD4520BPW

ACTIVE

TSSOP

PW

16

90

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

CD4520BPWR

ACTIVE

TSSOP

PW

16

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-1-250C-UNLIM

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

Addendum-Page 1