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SSG4575 Arkusz danych(PDF) 2 Page - SeCoS Halbleitertechnologie GmbH |
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SSG4575 Arkusz danych(HTML) 2 Page - SeCoS Halbleitertechnologie GmbH |
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2 / 7 page ![]() Electrical Characteristics N Channel( Tj=25 C Unless otherwise specified) Total Gate Charge RDS(ON) http://www.SeCoSGmbH.com/ Any changing of specification will not be informed individual Crss Qg Qgs Qgd Td(ON) Td(Off) Tr Ciss Coss Tf 36 42 18 5 10 10 6 32 10 1670 160 117 m nC nS pF 8 Parameter Symbol Max. Typ. Test Condition Min. Unit Drain-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Gate Threshold Voltage Gate-Source Leakage Current Drain-Source Leakage Current (Tj=25 ) Static Drain-Source On-Resistance Drain-Source Leakage Current (Tj=70 ) Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance BVDSS BVDS/ Tj Ω VGS=0V VDS=25V f=1.0MHz VDD=30V ID=1A VGS=10V RG=3.3 RD=30 Ω Ω ID=5A VDS=48V VGS=4.5V VGS=10V, ID=5A VGS=4.5V, ID=3A _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 2 Forward Transconductance Gfs S VDS=10V, ID=4A _ _ _ 2670 2 2 C o C o o 29 IDSS 60 0.04 60V,V 48V,V 1.0 3.0 100 1 25 ± V V/ Reference to 25C, ID=1mA o oC V nA uA uA VGS(th) IGSS VGS=0V, ID=250uA VGS= 20V ± VDS= GS =0 VDS= GS =0 VDS=VGS, ID=250uA _ _ _ _ _ _ _ _ _ _ _ 01-Jun-2002 Rev. A Page 2 of 7 Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse width 300us, dutycycle 2%. ≦ ≦ 3.Surface mounted on 1 in2copper pad of FR4 board; 135 C/W when mounted on Min. copper pad. o Elektronische Bauelemen Enhancement Mode Power Mos.FET te SSG4575 N Channel 6A, 60V,RDS(ON) 36m P Channel -4.2A, - 60V,RDS(ON) 72m Ω Ω Source-Drain Diode Parameter Symbol Max. Typ. Test Condition Min. Unit Forward On Voltage VDS _ _ IS=1.7A Is= 5A, V 34 48 , VGS=0V. V nC nS 1.2 Reverse Recovery Time Reverse Recovery Charge GS =0V _ _ _ _ Trr Qrr dl/dt=100A/uS 2 2 |
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