TLC876M, TLC876I, TLC876C

10-BIT 20 MSPS PARALLEL OUTPUT CMOS

ANALOG-TO-DIGITAL CONVERTERS

SLAS140D – JULY 1997 – REVISED MAY 2000

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POST OFFICE BOX 655303

Analog-to-Digital Converter (ADC)

Logic

Outline Package (SSOP), or Thin Small

Outline Package (TSOP)

Devices AD876

applications

description

The TLC876 is a CMOS, low-power, 10-bit, 20 MSPS analog-to-digital converter (ADC). The speed, resolution,

and single-supply operation are suited for applications in video, multimedia, imaging, high-speed acquisition,

and communications. The low-power and single-supply operation satisfy requirements for high-speed portable

applications. The speed and resolution ideally suit charge-coupled device (CCD) input systems such as color

scanners, digital copiers, electronic still cameras, and camcorders. A multistage pipelined architecture with

output error correction logic provides for no missing codes over the full operating temperature range. Force and

sense connections to the reference inputs provide a more accurate internal reference voltage to the reference

resistor string.

A standby mode of operation reduces the power to typically 15 mW. The digital I/O interfaces to either 5-V or

3.3-V logic and the digital output terminals can be placed in a high-impedance state. The format of the output

data is straight binary coding.

A pipelined multistaged architecture achieves a high sample rate with low power consumption. The TLC876

distributes the conversion over several smaller ADC sub-blocks, refining the conversion with progressively

higher accuracy as the device passes the results from stage to stage. This distributed conversion requires a

small fraction of the 1023 comparators used in a traditional flash ADC. A sample-and-hold amplifier (SHA) within

each of the stages permits the first stage to operate on a new input sample while the second through the fifth

stages operate on the four preceding samples.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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AGND

D0

D1

D2

D3

D4

D5

D6

D7

D8

D9

DRGND

DGND

AIN

CML

REFBS

REFBF

NC

REFTF

REFTS

DGND

AGND

STBY

OE

CLK

(TOP VIEW)

NC – No internal connection

DB, DW, OR PW PACKAGE

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Copyright

© 1999, Texas Instruments Incorporated

On products compliant to MIL-PRF-38535, all parameters are tested

unless otherwise noted. On all other products, production

processing does not necessarily include testing of all parameters.