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MPC8533ECHXARJB Arkusz danych(PDF) 37 Page - Freescale Semiconductor, Inc |
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MPC8533ECHXARJB Arkusz danych(HTML) 37 Page - Freescale Semiconductor, Inc |
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37 / 116 page ![]() MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 Freescale Semiconductor 37 Enhanced Three-Speed Ethernet (eTSEC), MII Management Figure 20 provides the AC test load for eTSEC. Figure 20. eTSEC AC Test Load Figure 21 shows the RMII receive AC timing diagram. Figure 21. RMII Receive AC Timing Diagram RXD[1:0], CRS_DV, RX_ER hold time to REF_CLK rising edge tRMRDX 2.0 — — ns — Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K) going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Table 34. RMII Receive AC Timing Specifications (continued) At recommended operating conditions with L/TVDD of 3.3 V ± 5%.or 2.5 V ± 5%. Parameter/Condition Symbol1 Min Typ Max Unit Notes Output Z0 = 50 Ω LVDD/2 RL = 50 Ω REF_CLK RXD[1:0] tRMRDX tRMR tRMRH tRMRR tRMRF CRS_DV RX_ER tRMRDV Valid Data |
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