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CPC7595MATR Arkusz danych(PDF) 22 Page - Clare, Inc. |
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CPC7595MATR Arkusz danych(HTML) 22 Page - Clare, Inc. |
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22 / 24 page ![]() CPC7595 22 www.clare.com R02 3.1.3 CPC7595M NOTE: As the metallic pad on the bottom of the DFN package is connected to the substrate of the die, Clare recommends that no printed circuit board traces cross this area to avoid potential shorting issues. 28-Lead DFN Package Recommended PCB Land Pattern Dimensions mm (inches) 7.0 (0.276) 11.0 (0.433) 7.5±0.05 (0.296±0.002) 5.0±0.05 (0.197±0.002) 0.75 (0.030) 0.33 +0.07,-0.05 (0.013 +0.003, -0.002) 0.55±0.10 (0.022±0.004) Bottom side metallic pad Pin 1 0.90±0.10 (0.036 ±0.004) 0.02 +0.03, -0.02 (0.001 +0.0012, -0.001) Seating Plane 0.20 (0.008) Pin 1 6.70 (0.264) 0.75 (0.03) 0.35 (0.016) 1.05 (0.045) |
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