22

TPR0441BX–SMS–09/09

ATVaultIC460

3.6.3

Packages characteristics

Figure 3-13.

SOIC-8 package characteristics

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.

2. Mismatch of the upper and lower dies and resin burrs are not included.

3. It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded.

4. Determines the true geometric position.

5. Values b and C apply to pb/Sn solder plated terminal.

The standard thickness of the solder layer shall be 0.010 +0.010/-0.005 mm.

A

1.70

2.16

A1

0.05

0.25

b

0.35

0.48

5

C

0.15

0.35

5

D

5.13

5.35

E1

5.18

5.40

2, 3

E

7.70

8.26

L

0.51

0.85

?

0˚

8˚

e

1.27 BSC

4

End View

Side View

e

b

A

A1

D

E

N

1

C

E1

?

L

Top View