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AS1344

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-

istics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

VCC, VIN, EN, SWOUT, POK, FB to GND

5

V

VOUT, LX to GND

45

Thermal Resistance

36.7

ºC/W

on PCB

ESD

2

kV

HBM MIL-Std. 883E 3015.7 methods

Latch-Up

-200

+100

mA

@25°C, JEDEC 78

Operating Temperature Range

-40

+85

ºC

Storage Temperature Range

-65

+150

ºC

Junction Temperature

125

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020D “Moisture/Reflow

Sensitivity Classification for Non-Hermetic

Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).