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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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AS2533F Arkusz danych(PDF) 23 Page - ams AG |
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AS2533F Arkusz danych(HTML) 23 Page - ams AG |
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23 / 25 page  Data Sheet AS2533-36 austriamicrosystems Conditions for Delivery as Dice on Foil, sawn Die thickness 380 ± 20µm Back finishing back grinding, silicon Frame Material: Plastic Size: see figure Frame Position Tolerance Center wafer to frame: ± 4mm Angle deviation wafer to frame: ± 8° Orientation wafer to frame: Wafer flat to frame side with kerfs Covering adhesive foil to frame: >5mm Tape Type: PVC with acrylic adhesive Thickness: 70 ± 20 µm Sawing conditions Sawing mode: Saw - through mode Sawing width: typ. 60 µm Kerf depth in foil: typ. 20 µm XV -dimension deviation: max.25 µm Packing frame sealed in foil bags filled with nitrogen Storage time In sealed bags 2 months, Tamb = 25 °C Mechanical Drawing of Frame Revision 8.8 Page 23 of 25 |
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