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AS8202NF Arkusz danych(PDF) 18 Page - ams AG |
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AS8202NF Arkusz danych(HTML) 18 Page - ams AG |
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18 / 20 page ![]() www.austriamicrosystems.com and TTTech Computertechnik AG Revision 2.1 18 - 20 AS8202NF TTP-C2NF Data Sheet - Pa ckag e Drawings and Mark in gs 8 Package Drawings and Markings The product is available in LQFP80 package. Figure 11. package Diagram Note: 1. All dimensions are in millimeters, angle is in degrees. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm per side. D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Dimensioning and tolerancing conform to JEDEC MS-026 Rev A. 4. The top package body size may be smaller than the bottom body size by as much as 0.15 mm. Table 15. package Dimensions Symbol Min Typ Max Symbol Min Typ Max D 15.8 16 16.2 c1 0.09 0.16 D1 13.9 14 14.1 e 0.65 E 15.8 16 16.2 ccc 0.10 E1 13.9 14 14.1 ddd 0.13 b 0.22 0.32 0.38 N 80 b1 0.22 0.3 0.33 N/2 40 c 0.09 0.2 N/4 20 |
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