BRIGHT VIEW

ELECTRONICS CO.,LTD

Apply to LAMP(DIP) series.

Description:

( 1 ) Manual soldering (Solder Iron)

(1.1) Temperature at tip of the iron: 300°C Max.

(1.2) It's banned to load any stress on the resin during soldering.

(1.3) Soldering time: 3 sec. Max.(one time only)

(1.4) Leave 3mm of minimum distance from the base of epoxy.

( 2 ) Dip Soldering(Wave soldering-Solder Bath)

(2.1) Leave 3mm of minimum distance from the base of the epoxy.

Soldering beyond the base of the tie bar(stand off) is recommended.

(2.2) When soldering, do not put stress on the LEDs during heating.

(2.3) Cutting the leadframes at high temperatures may cause LED failure.

(2.4) Never take next process until the component is cooled down to room temperature

after reflow.

(2.5) After soldering, do not warp the circuit board.

(2.6) The recommended dip soldering profile is the following:

2009/3/17 – C

ULTRA BRIGHTNESS LED LAMP

BVU-3X16WI4

300.0

Time ( sec. )

Degree C.

275.0

225.0

250.0

150.0

125.0

175.0

200.0

100.0

75.0

25.0

50.0

0.0

0.0

50.0

150.0

100.0

300.0

250.0

200.0

>20 C

4 C / sec.

150 C