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ADP151ACBZ-2.5-R7 Arkusz danych(PDF) 20 Page - Analog Devices |
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ADP151ACBZ-2.5-R7 Arkusz danych(HTML) 20 Page - Analog Devices |
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20 / 24 page ![]() ADP151 Rev. 0 | Page 20 of 24 OUTLINE DIMENSIONS *COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS. 1.60 BSC 2.80 BSC 1.90 BSC 0.95 BSC 0.20 0.08 0.60 0.45 0.30 8° 4° 0° 0.50 0.30 0.10 MAX *1.00 MAX *0.90 MAX 0.70 MIN 2.90 BSC 5 4 1 2 3 SEATING PLANE Figure 53. 5-Lead Thin Small Outline Transistor Package [TSOT] (UJ-5) Dimensions show in millimeters 0.050 NOM COPLANARITY 0.800 0.760 SQ 0.720 0.230 0.200 0.170 0.280 0.260 0.240 0.660 0.600 0.540 0.430 0.400 0.370 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) A 1 2 B SEATING PLANE 0.40 BALL PITCH BALL A1 IDENTIFIER Figure 54. 4-Ball Wafer Level Chip Scale Package [WLCSP] (CB-4-3) Dimensions show in millimeters |
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