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MIC2829 Arkusz danych(PDF) 6 Page - Micrel Semiconductor

Numer części MIC2829
Szczegółowy opis  3G/4G HEDGE/LTE PMIC with Six Buck Converters, Eleven LDOs and SIM Card Level Translation
PDF  52 Pages
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Producent  MICREL [Micrel Semiconductor]
Strona internetowa  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC2829 Arkusz danych(HTML) 6 Page - Micrel Semiconductor

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Micrel Inc.
MIC2829
May 2010
6
M9999-051410-B
Pin # A
Pin # B
Pin # G
Pin name
Description
B25
ENDC5
Enable DC5. Do not leave floating.
A37
PGND5
Power ground of DC5.
B26
RSTIN
Digital reset input for SIM card.
A38
PGND6
Power ground of DC6.
B27
ENDC6
Enable DC6. Do not leave floating.
A39
SW6
Switch output of DC6.
B28
FB6
Output sense pin of DC6 (Adjustable regulator).
A40
PVIN6
Power input of DC6.
B29
ENL3
Enable LDO3. Do not leave floating.
A41
ENGLB
Global enable for DC1, DC3, DC4 and LDO1, LDO2, LDO11. Do not leave floating.
B30
SUB1
Guard ring ground connection. Connect to AGND1 and AGND2.
A42
ENL5
Enable LNR5. Do not leave floating.
B31
ENL4
Enable LDO4. Do not leave floating.
A43
AGND1
Analog ground. Connect all AGND pins together.
B32
LDO11
LDO11 output.
A44
LDO1
LDO1 output.
G1
Thermal Via
Thermal via. Connect to ground.
G2
Thermal Via
Thermal via. Connect to ground.
G3
Thermal Via
Thermal via. Connect to ground.
G4
Thermal Via
Thermal via. Connect to ground.
G5
Thermal Via
Thermal via. Connect to ground.
G6
Thermal Via
Thermal via. Connect to ground.
G7
Thermal Via
Thermal via. Connect to ground.
G8
Thermal Via
Thermal via. Connect to ground.
G9
Thermal Via
Thermal via. Connect to ground.



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