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MPXV7007DP Arkusz danych(PDF) 9 Page - Freescale Semiconductor, Inc

Numer części MPXV7007DP
Szczegółowy opis  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  10 Pages
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Producent  FREESCALE [Freescale Semiconductor, Inc]
Strona internetowa  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPXV7007DP Arkusz danych(HTML) 9 Page - Freescale Semiconductor, Inc

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MPXV7007
Sensors
Freescale Semiconductor
9
Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE O
SMALL OUTLINE PACKAGE
NOTES:
1.
2.
3.
4.
CONTROLLING DIMENSION: INCH.
INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
N
A
C
0.004 (0.1)
DETAIL G
SEATING
PLANE
8X
P
T
∅
D
E
e/2
e
A
M
0.004 (0.1)
B
C
E1
A
B
A
0.008 (0.20)
B
C
8X
b
2 PLACES 4 TIPS
1
4
8
5
F
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.300
0.330
7.11
7.62
A1
0.002
0.010
0.05
0.25
b
0.038
0.042
0.96
1.07
D
0.465
0.485
11.81
12.32
E
E1
0.465
0.485
11.81
12.32
e
M
0.270
0.290
6.86
7.36
N
0.080
0.090
2.03
2.28
P
0.009
0.011
0.23
0.28
T
0.115
0.125
2.92
3.17
0.100 BSC
2.54 BSC
F
0.245
0.255
6.22
6.47
K
0.120
0.130
3.05
3.30
L
0.061
0.071
1.55
1.80
0˚
7˚
0˚
7˚
θ
0.717 BSC
18.21 BSC
K
M
GAGE
PLANE
DETAIL G
L
A1
θ
.014 (0.35)



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