ADP8863ACPZ-R7 datasheet(5/48 Pages) AD

5 / 48 page

ADP8863

Rev. 0 | Page 5 of 48

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, VOUT

−0.3 V to +6 V

D1, D2, D3, D4, D5, D6, and D7

−0.3 V to +6 V

CMP_IN

−0.3 V to +6 V

nINT, nRST, SCL, and SDA

−0.3 V to +6 V

Output Short-Circuit Duration

Indefinite

Operating Ambient Temperature Range

–40°C to +85°C1

Operating Junction Temperature Range

–40°C to +125°C

Storage Temperature Range

–65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

ESD (Electrostatic Discharge)

Human Body Model (HBM)

±3 kV

Charged Device Model (CDM)

±1.5 kV

1 The maximum operating junction temperature (TJ(MAX)) takes precedence

over the maximum operating ambient temperature (TA(MAX)). See the

Maximum Temperature Ranges section for more information.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all voltages are

referenced to ground.

MAXIMUM TEMPERATURE RANGES

The maximum operating junction temperature (TJ(MAX)) takes

precedence over the maximum operating ambient temperature

(TA(MAX)). Therefore, in situations where the ADP8863 is

exposed to poor thermal resistance and high power dissipation

(PD), the maximum ambient temperature may need to be

derated. In these cases, the maximum ambient temperature can

be calculated with the following equation:

TA(MAX) = TJ(MAX) − (θJA × PD(MAX))

THERMAL RESISTANCE

θJA (junction to air) is specified for the worst-case conditions,

that is, a device soldered in a circuit board for surface-mount

packages. The θJA, θJB (junction to board), and θJC (junction to

case) are determined according to JESD51-9 on a 4-layer

printed circuit board (PCB) with natural convection cooling.

For the LFCSP package, the exposed pad must be soldered to

the GND1 and/or GND2 terminal(s) on the board.

Table 3. Thermal Resistance

Package Type

θJA

θJC

Unit

20-Lead LFCSP_WQ

49.5

5.3

°C/W

ESD CAUTION

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