© 2009 Microchip Technology, Inc.

DS41393A-Page 29

9

ELECTRICAL SPECIFICATIONS

9.1

Ambient temperature under bias..........................................................................................................-40° to +125°C

Storage temperature ........................................................................................................................ -65°C to +150°C

Voltage on VDD with respect to VSS .................................................................................................. -0.3V to +6.5V

Voltage on all other pins with respect to VSS .......................................................................... -0.3V to (VDD + 0.3V)

Total power dissipation …..............................................................................................................................800 mW

Maximum current out of VSS pin ................................................................................................................... 300 mA

Maximum current into VDD pin ...................................................................................................................... 250 mA

Input clamp current (VI < 0 or VI > VDD)........................................................................................................± 20 mA

Maximum output current sunk by any I/O pin.................................................................................................... 25 mA

Maximum output current sourced by any I/O pin .............................................................................................. 25 mA

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

This device is sensitive to ESD damage and must be

handled appropriately. Failure to properly handle and

protect the device in an application may cause partial

to complete failure of the device.