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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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IMC01TS Arkusz danych(PDF) 25 Page - Tyco Electronics |
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IMC01TS Arkusz danych(HTML) 25 Page - Tyco Electronics |
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25 / 28 page  108-98001 Rev. M All specifications subject to change. Consult Tyco Electronics for latest specifications. 25 of 28 AXICOM Signal Relays IM Relay Soldering conditions according IEC 60058-2-58 and IPC/JEDEC J-STD-020B Infrared Soldering: Temperature/Time Profile (Lead and Housing Peak Temperature) 240 °C 180 °C 130 °C 100 °C 20 - 40 sec Full line: typical Dotted line: process limits forced cooling Time (s) Time (s) Infrared Soldering: Temperature/Time Profile (Lead and Housing Peak Temperature) Time (s) Recommended Soldering Conditions Recommended Reflow Soldering Profile Resistance to Soldering Heat - Reflow Profile Vapor Phase Soldering: Temperature/Time Profile (Lead and Housing Peak Temperature) |
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