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STM6502 Arkusz danych(PDF) 15 Page - STMicroelectronics |
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STM6502 Arkusz danych(HTML) 15 Page - STMicroelectronics |
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15 / 29 page ![]() STM6502, STM6503, STM6504, STM6505 Maximum ratings Doc ID 16101 Rev 5 15/29 3 Maximum ratings Stressing the device above the rating listed in Table 4: Absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 4. Absolute maximum ratings Symbol Parameter Value Unit TSTG Storage temperature (VCC off) –55 to +150 °C TSLD (1) 1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds. Lead solder temperature for 10 seconds 260 °C θJA Thermal resistance (junction to ambient) TDFN8 149.0 °C/W VIO Input or output voltage –0.3 to 5.5(2) 2. For inputs or outputs with internal pull-up resistors and push-pull type outputs –0.3 to VCC+0.3 V only. V VCC Supply voltage –0.3 to 7 V |
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