ADP160ACBZ-2.5-R7 datasheet(17/20 Pages) AD

17 / 20 page

ADP160/ADP161

Rev. 0 | Page 17 of 20

140

120

100

0.3

4.8

4.3

3.8

3.3

2.8

2.3

1.8

1.3

0.8

VIN – VOUT (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 200mA

MAXIMUM JUNCTION TEMPERATURE

140

120

100

0.3

4.8

4.3

3.8

3.3

2.8

2.3

1.8

1.3

0.8

VIN – VOUT (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 200mA

MAXIMUM JUNCTION TEMPERATURE

Figure 44. 100 mm2 of PCB Copper, TSOT, TA = 50°C

Figure 46. TSOT, TA = 85°C

140

120

100

0.3

4.8

4.3

3.8

3.3

2.8

2.3

1.8

1.3

0.8

VIN – VOUT (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 200mA

MAXIMUM JUNCTION TEMPERATURE

PCB LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP160/ADP161.

However, as listed in Table 8, a point of diminishing returns is

reached eventually, beyond which an increase in the copper size

does not yield significant heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUT and GND pins. Use of 0402 or 0603 size capacitors and

resistors achieves the smallest possible footprint solution on

boards where area is limited.

Figure 45. WLCSP, TA = 85°C

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