© 2007 Microchip Technology Inc.

DS22061A-page 19

MCP1602

8-Lead Plastic Dual Flat, No Lead Package (MF) – 3x3x0.9 mm Body [DFN]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. Package is saw singulated.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

8

Pitch

e

0.65 BSC

Overall Height

A

0.80

0.90

1.00

Standoff

A1

0.00

0.02

0.05

Contact Thickness

A3

0.20 REF

Overall Length

D

3.00 BSC

Exposed Pad Width

E2

0.00

–

1.60

Overall Width

E

3.00 BSC

Exposed Pad Length

D2

0.00

–

2.40

Contact Width

b

0.25

0.30

0.35

Contact Length

L

0.20

0.30

0.55

Contact-to-Exposed Pad

K

0.20

–

–

BOTTOM VIEW

TOP VIEW

D

N

E

NOTE 1

12

EXPOSED PAD

b

e

N

L

E2

K

NOTE 1

D2

21

NOTE 2

A

A1

A3

Microchip Technology Drawing C04-062B