E2000 datasheet(98/104 Pages) INTEL

98 / 104 page

Boxed Processor Specifications

Datasheet

7.3

Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution used by the

boxed processor.

7.3.1

Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a fan heatsink. However, meeting the

processor's temperature specification is also a function of the thermal design of the

entire system, and ultimately the responsibility of the system integrator. The processor

temperature specification is listed in Chapter 5. The boxed processor fan heatsink is

able to keep the processor temperature within the specifications (see Table 26) in

chassis that provide good thermal management. For the boxed processor fan heatsink

to operate properly, it is critical that the airflow provided to the fan heatsink is

unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan

heatsink. Airspace is required around the fan to ensure that the airflow through the fan

heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling

efficiency and decreases fan life. Figure 29 and Figure 30 illustrate an acceptable

airspace clearance for the fan heatsink. The air temperature entering the fan should be

kept below 38 ºC. Again, meeting the processor's temperature specification is the

responsibility of the system integrator.

Figure 28.

Baseboard Power Header Placement Relative to Processor Socket

Boxed Proc PwrHeaderPlacement

R110

[4.33]

E2000 Arkusz danych(PDF) 98 Page - Intel Corporation