STM32F103C8T7TR datasheet(37/96 Pages) STMICROELECTRONICS

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STM32F103x8, STM32F103xB

Electrical characteristics

Doc ID 13587 Rev 12

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5.3.2

Operating conditions at power-up / power-down

Subject to general operating conditions for TA.

Table 10.

Operating conditions at power-up / power-down

5.3.3

Embedded reset and power control block characteristics

The parameters given in Table 11 are derived from tests performed under ambient

temperature and VDD supply voltage conditions summarized in Table 9.

Power dissipation at TA = 85 °C

for suffix 6 or TA = 105 °C for

suffix 7(3)

LFBGA100

454

LQFP100

434

TFBGA64

308

LQFP64

444

LQFP48

363

VFQFPN36

1110

Ambient temperature for 6

suffix version

Maximum power dissipation

–40

°C

Low power dissipation(4)

–40

105

Ambient temperature for 7

suffix version

Maximum power dissipation

–40

105

°C

Low power dissipation(4)

–40

125

Junction temperature range

6 suffix version

–40

105

°C

7 suffix version

–40

125

When the ADC is used, refer to Table 45: ADC characteristics.

It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV

between VDD and VDDA can be tolerated during power-up and operation.

If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal

characteristics on page 86).

In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see

Table 6.2: Thermal characteristics on page 86).

Table 9.

General operating conditions (continued)

Symbol

Parameter

Conditions

Min

Max

Unit

Symbol

Parameter

Conditions

Min

Max

Unit

tVDD

VDD rise time rate



µs/V

VDD fall time rate



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