MPC5673F datasheet(22/132 Pages) FREESCALE

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MPC5674F Microcontroller Data Sheet, Rev. 6

Electrical Characteristics

Freescale Semiconductor

6 Indicates the average thermal resistance between the die and the case top surface as measured by the

cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case

temperature.

7 Thermal characterization parameter indicating the temperature difference between package top and the

junction temperature per JEDEC JESD51-2.

Table 5. Thermal Characteristics, 516-pin TEPBGA Package1

1 Thermal characteristics are targets based on simulation that are subject to change per device

characterization. This data is PRELIMINARY based on similar package used on other devices.

Characteristic

Symbol

Value

Unit

Junction to Ambient 2,3 Natural Convection (Single layer board)

2 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting

site (board) temperature, ambient temperature, air flow, power dissipation of other components on the

board, and board thermal resistance.

3 Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

RθJA

°C/W

Junction to Ambient 2,4 Natural Convection (Four layer board 2s2p)

4 Per JEDEC JESD51-6 with the board horizontal.

RθJA

°C/W

Junction to Ambient (@200 ft./min., Single layer board)

RθJMA

°C/W

Junction to Ambient (@200 ft./min., Four layer board 2s2p)

RθJMA

°C/W

Junction to Board 5

5 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board

temperature is measured on the top surface of the board near the package.

RθJB

°C/W

Junction to Case 6

6 Indicates the average thermal resistance between the die and the case top surface as measured by the

cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case

temperature.

RθJC

6°C/W

Junction to Package Top 7 Natural Convection

7 Thermal characterization parameter indicating the temperature difference between package top and the

junction temperature per JEDEC JESD51-2.

2°C/W

Table 6. Thermal Characteristics, 324-pin Package1

1 Thermal characteristics are targets based on simulation that are subject to change per device

characterization. This data is PRELIMINARY based on similar package used on other devices.

MPC5567 Thermal Characteristic

Symbol

Value

Unit

Junction to ambient 2, 3, natural convection (one-layer board)

RθJA

°C/W

Junction to ambient 1, 4, natural convection (four-layer board 2s2p)

RθJA

°C/W

Junction to ambient (@200 ft./min., one-layer board)

RθJMA

°C/W

Junction to ambient (@200 ft./min., four-layer board 2s2p)

RθJMA

°C/W

Junction to board 5 (four-layer board 2s2p)

RθJB

°C/W

Junction to case 6

RθJC

7°C/W

Junction to package top 7, natural convection

2°C/W

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