ZXTC4591AMC

Document number: DS31925 Rev. 2 - 2

2 of 9

www.diodes.com

January 2010

© Diodes Incorporated

A Product Line of

Diodes Incorporated

ZXTC4591AMC

Maximum Ratings

Parameter

Symbol

NPN

PNP

Unit

Collector-Base Voltage

40

-40

V

Collector-Emitter Voltage

40

-40

V

Emitter-Base Voltage

5

-5

V

Peak Pulse Current

3

-3

A

Continuous Collector Current(a)(f)

2

-1.5

A

Continuous Collector Current(b)(f)

2.5

-2.0

A

Base Current

300

mA

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Linear Derating Factor

1.5

12

W

mW/

°C

Linear Derating Factor

2.45

19.6

W

mW/

°C

Linear Derating Factor

1

8

W

mW/

°C

Linear Derating Factor

1.13

9

W

mW/

°C

Linear Derating Factor

1.7

13.6

W

mW/

°C

Linear Derating Factor

3

24

W

mW/

°C

Junction to Ambient (a) (f)

83.3

°C/W

Junction to Ambient (b) (f)

51

°C/W

Junction to Ambient (c) (f)

125

°C/W

Junction to Ambient (d) (f)

111

°C/W

Junction to Ambient (d) (g)

73.5

°C/W

Junction to Ambient (e) (g)

41.7

°C/W

Junction Temerature

150

°C

Storage Temperature Range

-55 to +150

°C

Notes:

a. For a dual device surface mounted on 8 sq cm single sided 2 oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The copper

area is split down the centre line into two separate areas with one half connected to each half of the dual device.

b. Measured at t <5 secs for a dual device surface mounted on 8 sq cm single sided 2 oz copper on FR4 PCB, in still air conditions with all exposed pads

attached. The copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.

c. For a dual device surface mounted on 8 sq cm single sided 2 oz copper on FR4 PCB, in still air conditions with minimal lead connections only.

d. For a dual device surface mounted on 10 sq cm single sided 1 oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The

copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.

e. For a dual device surface mounted on 85 sq cm single sided 2 oz copper on FR4 PCB, in still air conditions with all exposed pads attached. The

copper area is split down the centre line into two separate areas with one half connected to each half of the dual device.

f. For a dual device with one active die.

g. For dual device with 2 active die running at equal power.