MAX9268 datasheet(2/35 Pages) MAXIM

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ABSOLUTE MAXIMUM RATINGS

PACKAGE THERMAL CHARACTERISTICS (Note 1)

48 TQFP

Junction-to-Ambient Thermal Resistance (BJA).......27.6°C/W

Junction-to-Case Thermal Resistance (BJC).................2°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

AVDD to AGND ....................................................-0.5V to +3.9V

DVDD, IOVDD to AGND.......................................-0.5V to +3.9V

GND to AGND......................................................-0.5V to +0.5V

IN+, IN- to AGND .................................................-0.5V to +1.9V

TXOUT__, TXCLKOUT_ to AGND ........................-0.5V to +3.9V

All Other Pins to GND ......................... -0.5V to (VIOVDD + 0.5V)

TXOUT__, TXCLKOUT_ Short Circuit to Ground

or Supply ...............................................................Continuous

Continuous Power Dissipation (TA = +70°C)

48-Pin TQFP (derate 36.2mW/°C above +70°C)....2898.6mW

Human Body Model (RD = 1.5kΩ, CS = 100pF)

(IN+, IN-) to AGND..........................................................±8kV

(TXOUT__, TXCLKOUT_) to AGND .................................±8kV

All Other Pins to GND...................................................±3.5kV

IEC 61000-4-2 (RD = 330Ω, CS = 150pF)

Contact Discharge

(IN+, IN-) to AGND ..................................................±10kV

(TXOUT__, TXCLKOUT_) to AGND............................±8kV

Air Discharge

(IN+, IN-) to AGND........................................................±12kV

(TXOUT__, TXCLKOUT_) to AGND ...............................±20kV

ISO 10605 (RD = 2kΩ, CS = 330pF)

Contact Discharge

(IN+, IN-) to AGND..........................................................±8kV

(TXOUT__, TXCLKOUT_) to AGND .................................±8kV

Air Discharge

(IN+, IN-) to AGND........................................................±15kV

(TXOUT__, TXCLKOUT_) to AGND ...............................±30kV

Operating Temperature Range........................ -40°C to +105°C

Junction Temperature .....................................................+150°C

Storage Temperature Range............................ -65°C to +150°C

Lead Temperature (soldering, 10s) ................................+300°C

Soldering Temperature (reflow) ......................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

DC ELECTRICAL CHARACTERISTICS

(VAVDD = VDVDD = 3.0V to 3.6V, VIOVDD = 1.7V to 3.6V, RL = 100Ω Q1% (differential), TA = -40NC to +105NC, unless otherwise noted.

Typical values are at VAVDD = VDVDD = VIOVDD = 3.3V, TA = +25NC.)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

SINGLE-ENDED INPUTS (BWS, INT, CDS, EQS, MS, PWDN, SSEN, DRS)

High-Level Input Voltage

VIH1

0.65 x

VIOVDD

Low-Level Input Voltage

VIL1

0.35 x

VIOVDD

Input Current

IIN1

VIN = 0V to VIOVDD

-10

+10

Input Clamp Voltage

VCL

ICL = -18mA

-1.5

SINGLE-ENDED OUTPUTS (WS, SCK, SD/CNTL0, CNTL1, CNTL2/MCLK)

High-Level Output Voltage

VOH1

IOUT = -2mA

DCS = 0

VIOVDD

- 0.3

DCS = 1

VIOVDD

- 0.2

Low-Level Output Voltage

VOL1

IOUT = 2mA

DCS = 0

0.3

DCS = 1

0.2

Output Short-Circuit Current

IOS

VOUT = VGND,

DCS = 0

VIOVDD = 3.0V to 3.6V

VIOVDD = 1.7V to 1.9V

VOUT = VGND,

DCS = 1

VIOVDD = 3.0V to 3.6V

VIOVDD = 1.7V to 1.9V

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