MPC5601DXLL datasheet(24/77 Pages) FREESCALE

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MPC5602D Microcontroller Data Sheet, Rev. 3.1

Preliminary—Subject to Change Without Notice

Electrical characteristics

Freescale Semiconductor

4.6

Thermal characteristics

4.6.1

Package thermal characteristics

Table 10. LQFP thermal characteristics1

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions2

2 V

DD = 3.3 V ± 10% / 5.0 V ± 10%, TA = –40 to 125 °C

Pin count

Value3

3 All values need to be confirmed during device validation.

Unit

RJA CC

Thermal resistance,

junction-to-ambient natural

convection4

4 Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package. When Greek letters are not available, the symbols are typed as RthJA

and RthJMA.

Single-layer board —1s

72.1

°C/W

100

65.2

Four-layer board — 2s2p

57.3

100

51.8

RJB CC

Thermal resistance,

junction-to-board5

5 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package. When Greek letters are not available, the symbols are typed as RthJB.

Single-layer board — 1s

45.6

°C/W

100

42.6

Four-layer board — 2s2p

44.1

100

41.3

RJC CC

Thermal resistance,

junction-to-case6

6 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

When Greek letters are not available, the symbols are typed as RthJC.

Single-layer board — 1s

26.5

°C/W

100

23.9

Four-layer board — 2s2p

26.2

100

23.7



Junction-to-board thermal

characterization parameter, natural

convection

Single-layer board — 1s

°C/W

100

41.6

Four-layer board — 2s2p

100

43.4



Junction-to-case thermal

characterization parameter, natural

convection

Single-layer board — 1s

11.5

°C/W

100

10.4

Four-layer board — 2s2p

11.1

100

10.2

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