BSP613P_07 datasheet(2/8 Pages) INFINEON

2 / 8 page

2007-02-08

Rev.2.4

Page 2

BSP613P

Thermal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Characteristics

Thermal resistance, junction - soldering point

(Pin 4)

RthJS

K/W

Thermal resistance, junction - ambient, leaded

RthJA

100

SMD version, device on PCB:

@ min. footprint

@ 6 cm2 cooling area 1)

RthJA

100

Electrical Characteristics, at Tj = 25 °C, unless otherwise specified

Parameter

Symbol

Values

Unit

min.

typ.

max.

Static Characteristics

Drain-source breakdown voltage

VGS=0, ID=-250µA

V(BR)DSS

-60

Gate threshold voltage, VGS = VDS

ID=-1mA

VGS(th)

-2.1

-3

-4

Zero gate voltage drain current

VDS=-60V, VGS=0, Tj=25°C

VDS=-60V, VGS=0, Tj=125°C

IDSS

-0.1

-10

-1

-100

µA

Gate-source leakage current

VGS=-20V, VDS=0

IGSS

-10

-100

Drain-source on-state resistance

VGS=-10V, ID=2.9A

RDS(on)

0.11

0.13

Ω

1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain

connection. PCB is vertical without blown air.

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