W25Q16CLZPIP datasheet(69/77 Pages) WINBOND

Numer części	W25Q16CLZPIP

Szczegółowy opis	2.5V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

PDF	77 Pages

Scroll/Zoom	100%

Producent	WINBOND [Winbond]

Strona internetowa	http://www.winbond.com

Logo

69 / 77 page

W25Q16CL

Publication Release Date: July 08, 2010

- 69 -

Preliminary - Revision A

13. PACKAGE SPECIFICATION

13.1 8-Pin SOIC 150-mil (Package Code SN)

SEATING PLANE

0.25

GAUGE PLANE

E H

SEATING PLANE

0.25

GAUGE PLANE

E H

MILLIMETERS

INCHES

SYMBOL

Min

Max

Min

Max

1.35

1.75

0.053

0.069

0.10

0.25

0.004

0.010

0.33

0.51

0.013

0.020

0.19

0.25

0.008

0.010

(3)

3.80

4.00

0.150

0.157

(3)

4.80

5.00

0.188

0.196

(2)

1.27 BSC

0.050 BSC

5.80

6.20

0.228

0.244

(4)

---

0.10

---

0.004

0.40

1.27

0.016

0.050

0°

10°

0°

10°

Notes:

1. Controlling dimensions: millimeters, unless otherwise specified.

2. BSC = Basic lead spacing between centers.

3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.

4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.

W25Q16CLZPIP Arkusz danych(PDF) 69 Page - Winbond

W25Q16CLZPIP Arkusz danych(HTML) 69 Page - Winbond

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77

Arkusz danych Pobierz

Link URL