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CC2420-RTR1 Arkusz danych(PDF) 84 Page - Texas Instruments |
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CC2420-RTR1 Arkusz danych(HTML) 84 Page - Texas Instruments |
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84 / 92 page ![]() CC2420 SWRS041B Page 84 of 89 40 Recommended layout for package (QLP 48) Note: The figure is an illustration only and not to scale. There are nine 14 mil diameter via holes distributed symmetrically in the ground pad under the package. See also the CC2420 EM reference design. 40.1 Package thermal properties Thermal resistance Air velocity [m/s] 0 Rth,j-a [K/W] 25.6 40.2 Soldering information Recommended soldering profile is according to IPC/JEDEC J-STD-020C. |
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