CPC1986 datasheet(1/7 Pages) CLARE

Numer części	CPC1986

Szczegółowy opis	i4-PAC??Power Relay

PDF	7 Pages

Scroll/Zoom	100%

Producent	CLARE [Clare, Inc.]

Strona internetowa	http://www.clare.com

Logo

1 / 7 page

DS-CPC1986 - R06

www.clare.com

1

e3

RoHS

2002/95/EC

Characteristics

Features

• 1.6A

rms Load Current with 5°C/W Heat Sink

• Low 3

 On-Resistance

• 1000V

P Blocking Voltage

• 2500V

rms Input/Output Isolation

• Low Thermal Resistance (0.35 °C/W)

• Electrically Non-conductive Thermal Pad for Heat

Sink Applications

• Low Drive Power Requirements

• Arc-Free With No Snubbing Circuits

• No EMI/RFI Generation

• Machine Insertable, Wave Solderable

Applications

• Industrial Controls / Motor Control

• Robotics

• Medical Equipment—Patient/Equipment Isolation

• Instrumentation

• Multiplexers

• Data Acquisition

• Electronic Switching

• I/O Subsystems

• Meters (Watt-Hour, Water, Gas)

• Transportation Equipment

• Aerospace/Defense

Approvals

• UL 508 Certified Component: File E69938

Pin Configuration

Description

Clare and IXYS have combined to bring OptoMOS®

technology, reliability, and compact size to a new

family of high-power Solid State Relays.

As part of this family, the CPC1986 single-pole,

normally open (1-Form-A) Solid State Power Relay is

rated for up to 1.6Arms continuous load current with a

5°C/W heat sink.

The CPC1986 employs optically coupled MOSFET

technology to provide 2500Vrms of input to output

isolation. The output, constructed with efficient

MOSFET switches and photovoltaic die, uses Clare’s

patented OptoMOS architecture while the input, a

highly efficient GaAlAs infrared LED, provides the

optically coupled control. The combination of low

on-resistance and high load current handling

capability makes this relay suitable for a variety of high

performance switching applications.

The unique i4-PAC package pioneered by IXYS

enables Solid State Relays to achieve the highest load

current and power ratings. This package features a

unique IXYS process in which the silicon chips are soft

soldered onto the Direct Copper Bond (DCB)

substrate instead of the traditional copper leadframe.

The DCB ceramic, the same substrate used in high

power modules, not only provides 2500Vrms isolation

but also very low thermal resistance (0.35 °C/W).

Ordering Information

Switching Characteristics

Parameter

Rating

Units

Blocking Voltage

1000

VP

Load Current, TA=25°C:

With 5°C/W Heat Sink

1.6

Arms

No Heat Sink

0.65

On-Resistance

3



RJC

0.35

°C/W

3

-

24

+

1

Part

Description

CPC1986J

i4-PAC Package (25 per tube)

Form-A

I

F

I

LOAD

10%

90%

t

on

t

off

CPC1986

i4-PAC™ Power Relay

Podobny numer części - CPC1986

Producent	Numer części	Arkusz danych	Szczegółowy opis
Clare, Inc.	CPC1986	139Kb / 6P	i4-PAC??Power Relay
IXYS Corporation	CPC1986	199Kb / 7P	Low Drive Power Requirements
Clare, Inc.	CPC1986J	139Kb / 6P	i4-PAC??Power Relay
IXYS Corporation	CPC1986J	199Kb / 7P	Low Drive Power Requirements
IXYS Corporation	CPC1986J	196Kb / 3P	Power Relay Branding

More results

Podobny opis - CPC1986

Producent	Numer części	Arkusz danych	Szczegółowy opis
Clare, Inc.	CPC1978J	236Kb / 5P	i4-PAC??Power Relay
	CPC1908	151Kb / 6P	i4-PAC??Power Relay
	CPC1967	145Kb / 6P	i4-PAC??Power Relay
	CPC1977	145Kb / 6P	i4-PAC??Power Relay
	CPC1978	152Kb / 6P	i4-PAC??Power Relay
	CPC1986	139Kb / 6P	i4-PAC??Power Relay
	CPC1777	915Kb / 7P	i4-PAC??DC Power Relay
	CPC1908	886Kb / 7P	i4-PAC??Power Relay
	CPC1967	896Kb / 7P	i4-PAC??Power Relay
	CPC1978	910Kb / 7P	i4-PAC??Power Relay

More results

CPC1986 Arkusz danych(PDF) 1 Page - Clare, Inc.

CPC1986 Arkusz danych(HTML) 1 Page - Clare, Inc.

Podobny numer części - CPC1986

Podobny opis - CPC1986

Html Pages

1 2 3 4 5 6 7

Arkusz danych Pobierz

Link URL