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SP2526 Arkusz danych(PDF) 7 Page - Sipex Corporation |
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SP2526 Arkusz danych(HTML) 7 Page - Sipex Corporation |
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7 / 18 page ![]() 7 Rev. 8/21/01 SP2526 +3.0V to +5.5V USB Power Control Switch © Copyright 2001 Sipex Corporation minimum current of 0.5A to be delivered. The SP2526 MOSFET switches will exhibit very low resistance (<100m Ω) or voltage drop until the current limit is reached. The fold back current is the current that is delivered into a short circuit at the output. If the SP2526 MOSFET switch is enabled into a heavy load or short-circuit, the switch will im- mediately go into a constant-current mode, re- ducing the output voltage. The respective fault flag will pull low until the condition is removed. When a heavy load is connected to the SP2526 switch output, a large transient current may flow until the current limiting circuitry responds. The SP2526 will provide a low resistance switch (100m Ω) between the input and output pins. This low resistance will be maintained with increasing current until the 2.2A limit is reached. If load current exceeds this limit, the switch will increase its resistance. The foldback current (500mA minimum) is reached when there is a short applied to the output. The 100m Ω switch resistance is guaranteed for all load currents, increasing or decreasing, that are below 500mA. Thermal Shutdown Under nominal load conditions, the switch resis- tance is very low and internal power dissipation is low. Under short circuit conditions, current is limited and internal power dissipation is higher but not extreme. Under intermediate load condi- tions, both the voltage across the switch and the current through the switch are at intermediate values and internal power dissipation is highest. In this last condition, the die temperature will reach the thermal limit and the switches in both channels will be shut off. As the die subse- quently cools, the switch will turn on again. If the load is not removed, the device will thermal cycle in this manner to protect itself from dam- age. Thermal shutdown is asserted if the die tempera- ture exceeds 135OC and will not release until the die termperature drops below 125OC. Thermal shutdown will disable both output MOSFET switches and force both FLGA and FLGB fault flags low. The delay between a current limit fault and thermal shutdown will vary with ambient tem- perature, board layout, and load impedance, but is typically several hundred milliseconds. A designer can command a USB controller to recognize the fault and disable the appropriate channel within this time. TYPICAL APPLICATIONS Bypass Capacitors A 0.1 µF to 1.0µF bypass capacitor from the IN pin to the GND pin is recommended to control power supply transients. Refer to Figure 4. Without a bypass capacitor, an output short may cause sufficient ringing and damage the device. Without a bypass capacitor, excessive supply lead inductance is also a concern. Input or output transients must not exceed the absolute maximum supply voltage of V IN(MAX) = +6.0V even for a short duration to avoid risk of damage to the device. Transient Overcurrent Filter When the SP2526 is enabled, large values of capacitance at the output of the device will cause inrush current to exceed the short circuit current- limit threshold of the device and assert a flag fault condition for FLGA and/or FLGB. The duration of this time will depend on the size of the output capacitance. During the capacitance charging time, the device enters into foldback mode. As the capacitance is charged, the current decreases below the current-limit threshold and the fault flags that are present at the FLGA and/ or FLGB pins will then be deasserted. In USB applications, it is required that output bulk capacitance is utilized to support hot-plug occurences. When the SP2526 is enabled, the flag may go active for about 1ms due to inrush current exceeding the current-limit setpoint. Additionally, during hot-plug events, inrush cur- rents may also cause the fault flags at the FLGA and/or FLGB pins to go active. Since these conditions are not valid overcurrent faults, the USB controller must ignore the fault flags during these events. To prevent this, a 1ms RC filter can be implemented as shown in Figure 5. Alterna- |
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