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SL74HC192 Arkusz danych(PDF) 2 Page - System Logic Semiconductor |
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SL74HC192 Arkusz danych(HTML) 2 Page - System Logic Semiconductor |
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2 / 7 page ![]() SL74HC192 System Logic Semiconductor SLS MAXIMUM RATINGS * Symbol Parameter Value Unit VCC DC Supply Voltage (Referenced to GND) -0.5 to +7.0 V VIN DC Input Voltage (Referenced to GND) -1.5 to VCC +1.5 V VOUT DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V IIN DC Input Current, per Pin ±20 mA IOUT DC Output Current, per Pin ±25 mA ICC DC Supply Current, VCC and GND Pins ±50 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW Tstg Storage Temperature -65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) 260 °C *Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/ °C from 65° to 125°C SOIC Package: : - 7 mW/ °C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC DC Supply Voltage (Referenced to GND) 2.0 6.0 V VIN, VOUT DC Input Voltage, Output Voltage (Referenced to GND) 0 VCC V TA Operating Temperature, All Package Types -55 +125 °C tr, tf Input Rise and Fall Time (Figure 1) VCC =2.0 V VCC =4.5 V VCC =6.0 V 0 0 0 1000 500 400 ns This device contains protection circuitry to guard against damage d ue to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND ≤(V IN or VOUT) ≤V CC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. |
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