AT24CS02 datasheet(19/23 Pages) ATMEL

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Atmel AT24CS01/02 [PRELIMINARY DATASHEET]

8815A–SEEPR–6/12

14.2 8X — 8-lead TSSOP

DRAWING NO.

REV.

TITLE

GPC

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

1.20

0.05

0.15

0.80

1.00

1.05

2.90

3.00

3.10

2, 5

6.40 BSC

4.30

4.40

4.50

3, 5

0.19

–

0.30

0.65 BSC

0.45

0.60

0.75

1.00 REF

0.09

0.20

Side View

End View

Top View

Pin 1 indicator

this corner

Notes:

1. This drawing is for general information only. Refer to JEDEC

Drawing MO-153, Variation AA, for proper dimensions,

tolerances, datums, etc.

2. Dimension D does not include mold Flash, protrusions or gate

burrs. Mold Flash, protrusions and gate burrs shall not exceed

0.15 mm (0.006 in) per side.

3. Dimension E1 does not include inter-lead Flash or protrusions.

Inter-lead Flash and protrusions shall not exceed 0.25 mm

(0.010 in) per side.

4. Dimension b does not include Dambar protrusion. Allowable

Dambar protrusion shall be 0.08 mm total in excess of the b

dimension at maximum material condition. Dambar cannot be

located on the lower radius of the foot. Minimum space between

protrusion and adjacent lead is 0.07 mm.

5. Dimension D and E1 to be determined at Datum Plane H.

Package Drawing Contact:

packagedrawings@atmel.com

12/8/11

8X, 8-lead 4.4mm Body, Plastic Thin

Shrink Small Outline Package (TSSOP)

TNR

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