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STA309B Arkusz danych(PDF) 63 Page - STMicroelectronics |
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STA309B Arkusz danych(HTML) 63 Page - STMicroelectronics |
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63 / 66 page ![]() STA309B Package information Doc ID 022570 Rev 2 63/66 9 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 10. VFQFPN-56 (8 x 8 mm) package dimensions Reference mm Min. Typ. Max. A 0.80 0.90 1.00 A1 0 0.05 D8.00 D2 See exposed pad variations E8.00 E2 See exposed pad variations b 0.25 0.30 0.35 b1 0.20 0.25 0.30 e (pad pitch)(1) 1. Refer to Figure 11. L1 0.05 0.15 aaa 0.15 bbb 0.10 ddd 0.05 eee 0.08 fff 0.10 ccc 0.10 Table 11. Exposed pad variations Variation D2 E2 Min. Typ. Max Min. Typ. Max. A 5.85 5.90 5.95 5.85 5.90 5.95 B 4.25 4.30 4.35 4.25 4.30 4.35 |
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