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ACT4303 Arkusz danych(PDF) 9 Page - Active-Semi, Inc |
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ACT4303 Arkusz danych(HTML) 9 Page - Active-Semi, Inc |
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9 / 15 page ![]() ACT4303 Rev 0, 05-Dec-11 Active-Semi Innovative Power TM - 9 - www.active-semi.com Copyright © 2011 Active-Semi, Inc. STABILITY COMPENSATION CONT’D PC Board Layout Guidance When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the IC. 1) Arrange the power components to reduce the AC loop size consisting of CIN, IN pin, SW pin and the schottky diode. 2) Place input decoupling ceramic capacitor CIN as close to IN pin as possible. CIN is connected power GND with vias or short and wide path. 3) Return FB, COMP and ISET to signal GND pin, and connect the signal GND to power GND at a single point for best noise immunity. Connect exposed pad to power ground copper area with copper and vias. 4) Use copper plane for power GND for best heat dissipation and noise immunity. 5) Place feedback resistor close to FB pin. 6) Use short trace connecting HSB-CHSB-SW loop Figure 6 shows an example of PCB layout. Figure 7 gives a typical application schematic and associated BOM list. Figure 6: PCB Layout |
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