DYNAMIC CHARACTERISTICS

ARF1502

Symbol

C

iss

C

oss

C

rss

t

d(on)

t

r

t

d(off)

t

f

Characteristic

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Turn-on Delay Time

Rise Time

Turn-off Delay Time

Fall Time

Test Conditions

V

V

f = 1 MHz

V

V

I

R

MIN

TYP

MAX

4820

6000

800

1100

210

290

510

3.0

7

15

25

37

UNIT

pF

ns

FUNCTIONAL CHARACTERISTICS

Symbol

G

PS

η

ψ

Test Conditions

f = 27.12 MHz

V

V

No Degradation in Output Power

Characteristic

Common Source Amplifier Power Gain

Drain Efficiency

Electrical Ruggedness VSWR 10:1

MIN

TYP

MAX

15

17

70

75

UNIT

dB

%

APT Reserves the right to change, without notice, the specifications and information contained herein.

D

S

S

G

S

S

D

G

S

S

S

S

ARF1500

BeO

135-05

.005

.045

.160

.500

.500

1.065

.207

.207

.375

.105 typ.

1.065

D

S

G

dims: inches

HAZARDOUS MATERIAL

WARNING

The ceramic portion of the

device

between

leads

and

mounting surface is beryllium

oxide.

Beryllium oxide dust is

highly toxic when inhaled. Care

must be taken during handling

and mounting to avoid damage

to this area.

These devices

must never be thrown away with

general industrial or domestic

waste.

;;

yy

ARF 1500

Compliant

layer

Clamp

;;;;

yyyy

Heat Sink

Thermal Considerations and Package Mounting:

The rated 1500W power dissipation is only available when the package mounting

surface is at 25˚C and the junction temperature is 200˚C. The thermal resistance

between junctions and case mounting surface is 0.12 ˚C/W. When installed, an addi-

tional thermal impedance of 0.09 ˚C/W between the package base and the mounting

surface is typical. Insure that the mounting surface is smooth and flat. Thermal joint

compound must be used to reduce the effects of small surface irregularities. The heat-

sink should incorporate a copper heat spreader to obtain best results.

The package is designed to be clamped to a heatsink. A clamped joint maintains the

required mounting pressure while allowing for thermal expansion of both the device

and the heat sink. A simple clamp, a compliant layer of plastic or rubber, and two 6-32

(M3.5) screws can provide the minimum 85 lb required mounting force. T = 6 in-lb.