Applications information

TDA7267T

6/10

Doc ID 15776 Rev 2

4

Applications information

For 12-V supply and 8-

Ω speaker applications the maximum power dissipation is

approximately 1.2 W.

Assuming that the maximum ambient temperature is 70° C the required thermal resistance

of the devices must be equal to (150 - 70) / 1.2 = 67 °C/W.

The junction-to-pin thermal resistance of the package is about 23 °C/W. This means that an

external heatsink of around 43 °C/W is required.

The copper ground plane of the PCB can be used for dissipating this heat.

Figure 3.

Thermal resistance junction-to-ambient vs copper area on PCB

Figure 4.

Power derating curve

60.00

62.00

64.00

66.00

68.00

70.00

72.00

74.00

76.00

78.00

80.00

0

0.5

1

1.5

2

2.5

33.5

4

Cu Area on PCB (cm2)

60.00

62.00

64.00

66.00

68.00

70.00

72.00

74.00

76.00

78.00

80.00

0

0.5

1

1.5

2

2.5

33.5

4

Cu Area on PCB (cm2)

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

1.80

2.00

2.20

010

20

30405060

70

80

90

100 110 120 130 140 150 160

Copper Area 3 Cm2

NO Copper Area (others than tracks)

0.00

0.20

0.40

0.60

0.80

1.00

1.20

1.40

1.60

1.80

2.00

2.20

010

20

30405060

70

80

90

100 110 120 130 140 150 160

Copper Area 3 Cm2

NO Copper Area (others than tracks)

Obsolete

Product(s)

- Obsolete

Product(s)