T25 datasheet(5/12 Pages) STMICROELECTRONICS

5 / 12 page

BTA24, BTB24, BTA25, BTA26, BTB26, T25

Characteristics

5/12

Figure 7.

Non-repetitive surge peak on-state

current for a sinusoidal pulse with

width tp < 10 ms and corresponding

value of I2t

Figure 8.

Relative variation of gate trigger

current, holding current and

latching current versus junction

temperature (typical values)

0.01

0.10

1.00

10.00

100

1000

3000

(A), I t (A s)

TSM

t (ms)

T initial=25°C

ITSM

dI/dt limitation:

50A/µs

I t

-40

-20

100

120

140

0.0

0.5

1.0

1.5

2.0

2.5

T (°C)

I,I ,I [T ] /

GT H L

,I ,I [T =25°C]

GT H L

IGT

IH & IL

Figure 9.

Relative variation of critical rate of

decrease of main current versus

(dV/dt)c (typical values)

Figure 10.

Relative variation of critical rate of

decrease of main current versus Tj

Figure 11.

D2PAK thermal resistance junction to

ambient versus copper surface under

tab (printed circuit board FR4, copper

thickness: 35 µm)

0.1

1.0

10.0

100.0

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

(dV/dt)c (V/µs)

(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c

T2535/CW/BW

100

125

(dI/dt)c [T ] /

pecified]

(dI/dt)c [T s

T (°C)

S(cm²)

(°C/W)

th(j-a)

DPAK

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