HSP062-2

Recommendation on PCB assembly

Doc ID 022778 Rev 1

9/11

4.5

Reflow profile

Figure 15.

ST ECOPACK® recommended soldering reflow profile for PCB mounting

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

0

01

2345

67

Time (min)

Temperature (°C)

2°C/s recommended

6°C/s max

220°C

125 °C

260°C max

255°C

180°C

90 sec max

10-30 sec

90 to 150 sec

3°C/s max

0

01

2345

67

Time (min)

Temperature (°C)

2°C/s recommended

6°C/s max

220°C

125 °C

260°C max

255°C

180°C

90 sec max

10-30 sec

90 to 150 sec

3°C/s max